US Patent No. 10,462,901

IMPLEMENTING EMBEDDED WIRE REPAIR FOR PCB CONSTRUCTS


Patent No. 10,462,901
Issue Date October 29, 2019
Title Implementing Embedded Wire Repair For Pcb Constructs
Inventorship Samuel Connor, Apex, NC (US)
Stuart B. Benefield, Durham, NC (US)
Matthew S. Doyle, Chatfield, MN (US)
Joseph Kuczynski, North Port, FL (US)
Jonathan Jackson, Cedar Grove, NC (US)
Assignee International Business Machines Corporation, Armonk, NY (US)

Claim of US Patent No. 10,462,901

1. A method for implementing embedded wire repair for printed circuit board (PCB) constructs comprising:providing a printed circuit board (PCB) having an embedded repair wire layer in a PCB construct within a PCB stack with reference planes on opposite sides of the repair wire layer;
detecting erroneous wiring of said embedded repair wire layer in the PCB construct;
drilling an appropriate plated through hole (PTH) in the PCB stack for forming a repair connection in the erroneous wiring of said embedded repair wire layer;
wherein providing said embedded repair wire layer within the PCB stack includes providing multiple individual embedded wires within said embedded repair wire layer isolated from all other wiring layers; and
wherein providing said multiple individual embedded wires isolated from all other wiring layers includes routing respective individual embedded wires to respective plated through holes (PTHs) in the PCB stack.