1. An electronic device comprising:a substrate having a ground layer disposed between opposing top and bottom surfaces, wherein a plurality of conductive contacts is disposed on the bottom surface of the substrate and are electrically connected to the ground layer by a ground stitch via, wherein the substrate includes a plurality of relief cutouts along a perimeter, wherein each conductive contact is spaced apart by one of the relief cutouts;
an electrically conductive chassis having a mounting surface mounted to the conductive contacts along the bottom surface,
wherein an electromagnetic shield comprises the ground layer, the ground stitch via, the conductive contacts and the chassis to enclose the bottom surface of the substrate and protect the bottom surface from electromagnetic interference; and
a non-conductive cover assembled to the substrate in tension so that an interior surface of the cover applies a force to the top surface of the substrate thereby ensuring the chassis maintains in electrical contact with the ground layer.