US Patent No. 10,439,317


Patent No. 10,439,317
Issue Date October 08, 2019
Title Hermetically Sealed Electrical Connector Assembly
Inventorship David C. Horchler, Millersburg, PA (US)
Robert E. Marshall, Elizabethtown, PA (US)
Assignee FCI USA LLC, Etters, PA (US)

Claim of US Patent No. 10,439,317

1. An interposer comprising:a substrate that defines a first surface and a second surface opposite the first surface, electrical contact pads on each of the first and second surfaces, and vias that each extend through the substrate and electrically connect the electrical contact pads on the first surface with respective electrical contact pads on the second surface;
a seal member that at least partially surrounds the electrical contact pads on the first surface, and is configured to hermetically seal an interface between the first surface and a hard disk drive case of an electrical subassembly when the electrical subassembly is mated to the interposer; and
a surface mount connector mounted to the first surface via solder balls, wherein a portion of said solder balls has flowed into said vias.