US Patent No. 10,433,469

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE


Patent No. 10,433,469
Issue Date October 01, 2019
Title Semiconductor Package And Semiconductor Module
Inventorship Joungphil Lee, Suwon-si (KR)
Assignee Samsung Electronics Co., Ltd., Gyeonggi-do (KR)

Claim of US Patent No. 10,433,469

1. A semiconductor package comprising:a package substrate including an insulating layer and a ground layer, the ground layer longitudinally extending in the insulating layer, an end portion of the ground layer exposed by the insulating layer;
a semiconductor chip on the package substrate;
a molding layer on the package substrate and surrounding at least a side surface of the semiconductor chip; and
an electromagnetic shield layer covering the molding layer and the semiconductor chip, an end portion of the electromagnetic shield layer running in parallel with and being in contact with the end portion of the ground layer, the electromagnetic shield layer including a first lateral portion and a second lateral portion, the first lateral portion facing the side surface of the semiconductor chip, the second lateral portion at an end of the electromagnetic shield layer and horizontally spaced apart from the first lateral portion, the second lateral portion of the electromagnetic shield layer and a lateral end surface of the ground layer being on a substantially straight line and exposed to outside of the package substrate,
wherein the electromagnetic shield layer includes a conductive polymer and an adhesive polymer.