US Patent No. 10,433,468

HIGHLY RFI SHIELDED MODULAR ELECTRONICS PACKAGING SYSTEM


Patent No. 10,433,468
Issue Date October 01, 2019
Title Highly Rfi Shielded Modular Electronics Packaging System
Inventorship Silversun Sturgis, Socorro, NM (US)
Assignee Associated Universities, INC., Washington, DC (US)

Claim of US Patent No. 10,433,468

1. A Radio Frequency Interference (RFI) shielded electronics enclosure, comprising:at least one hollowed-out body having an inner lip and an outer lip, wherein the inner lip extends further than the outer lip;
at least one hollowed-out cover, wherein the at least one hollowed-out cover is adapted to cover the inner lip and abut the outer lip of the at least one hollowed-out body to prevent RFI leakage;
a plurality of fastening devices adapted to secure the at least one hollowed-out cover to the at least one hollowed-out body; and
a plurality of gaskets positioned between the at least one hollowed-out cover and the at least one hollowed-out body, wherein a first gasket of the plurality of gaskets is positioned adjacent to the inner lip and a second gasket of the plurality of gaskets is positioned adjacent to the outer lip of each of the at least one hollowed-out body.