US Patent No. 10,433,467

THERMAL DISSIPATION SYSTEM FOR WEARABLE ELECTRONIC DEVICES


Patent No. 10,433,467
Issue Date October 01, 2019
Title Thermal Dissipation System For Wearable Electronic Devices
Inventorship Erin Hurbi, San Francisco, CA (US)
Michael Nikkhoo, Saratoga, CA (US)
Assignee Microsoft Technology Licensing, LLC, Redmond, WA (US)

Claim of US Patent No. 10,433,467

1. A wearable thermal dissipation system comprising:a housing that at least partially encloses one or more electronic components that emit heat during operations;
at least one support structure that is coupled to the housing and that is configured to maintain a position of the housing with respect to a body part, wherein the at least one support structure includes a first region and a second region that is farther from the one or more electronic components than the first region; and
a thermal conduit that is positioned to absorb the heat emitted by the one or more electronic components and to transfer at least a portion of the heat through the first region to the second region, wherein one or more first properties of the first region result in the first region having a first thermal resistance from the thermal conduit to an ambient environment, and wherein one or more second properties of the second region result in the second region having a second thermal resistance from the thermal conduit to the ambient environment.