US Patent No. 10,433,454

PRESSURIZED UNDER-FLOOR WORK ENVIRONMENT


Patent No. 10,433,454
Issue Date October 01, 2019
Title Pressurized Under-floor Work Environment
Inventorship Giorgio Arturo Pompei, Seattle, WA (US)
Frank Andrew Glynn, Leesburg, VA (US)
Shawn Duane Patrick, Issaquah, WA (US)
Assignee Amazon Technologies, Inc., Seattle, WA (US)

Claim of US Patent No. 10,433,454

15. A prefabricated modular barrier assembly for forming a work area in an under-floor space of a datacenter, the under-floor space being disposed between a floor surface and a raised floor and used as a plenum to supply cooling air to datacenter components located above the raised floor, the work area being configured to inhibit a first airflow from the work area to the datacenter components, the barrier assembly comprising:one or more prefabricated airtight sections that can be passed through a rectangular opening approximately 2 feet by 2 feet, each of the one or more prefabricated airtight sections including:
one or more coupling features configured to enable joining of the one or more prefabricated airtight sections into an erected configuration that surrounds the work area portion and inhibits a second airflow from the work area portion into the remaining portion of the under-floor space;
a deformable lower edge seal member configured to interface with the floor surface to inhibit the second airflow from the work area portion into the remaining portion of the under-floor space; and
a deformable upper edge seal member configured to interface with the raised floor to inhibit the second airflow from the work area portion into the remaining portion of the under-floor space,
wherein the one or more prefabricated airtight sections comprise a plurality of inflatable column segments that, when inflated, separate the lower and upper edge seal members so as to hold the lower edge seal member in contact with the floor surface and hold the upper edge seal member in contact with the raised floor.