US Patent No. 10,433,433

WIRING SUBSTRATE FOR ELECTRONIC COMPONENT INSPECTION APPARATUS


Patent No. 10,433,433
Issue Date October 01, 2019
Title Wiring Substrate For Electronic Component Inspection Apparatus
Inventorship Takakuni Nasu, Komaki (JP)
Assignee NGK SPARK PLUG CO., LTD., Nagoya (JP)

Claim of US Patent No. 10,433,433

1. A wiring substrate for electronic component inspection apparatus comprising a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate,the wiring substrate for electronic component inspection apparatus being characterized in that
each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion or a nut tube portion which perpendicularly extends from a center portion of the flange portion; and
in a vertical cross section of the flange portion along an axial direction of the bolt portion or the nut tube portion, an outside surface of the flange portion from which the bolt portion or the nut tube portion protrudes is defined by a curve which is convex toward an inside surface of the flange portion facing the back surface of the first laminate.