US Patent No. 10,433,431

IMPLEMENTING CUSTOMIZED PCB VIA CREATION THROUGH USE OF MAGNETIC PADS


Patent No. 10,433,431
Issue Date October 01, 2019
Title Implementing Customized Pcb Via Creation Through Use Of Magnetic Pads
Inventorship Gerald K. Bartley, Rochester, MN (US)
Darryl J. Becker, Rochester, MN (US)
Matthew S. Doyle, Chatfield, MN (US)
Mark J. Jeanson, Rochester, MN (US)
Assignee International Business Machines Corporation, Armonk, NY (US)

Claim of US Patent No. 10,433,431

1. A method for implementing enhanced customized printed circuit board (PCB) via creation during printed circuit board (PCB) manufacturing comprising: providing a printed circuit board (PCB); forming a via extending through the printed circuit board (PCB); rendering at least one magnetic pad into the via before aqueous seed and plate processing in the PCB manufacture; performing PCB aqueous seed and plate processing, and said at least one magnetic pad selectively rendering copper in at least one selected region of the via.