1. An memory module card structure, comprising:a main board having a first surface and a second surface opposite to the first surface, the main board being divided into a mounting section and an inserting section along an inserting direction, the inserting sections of the first surface and the second surface respectively having a binding region and a soldering region, the soldering region having a plurality of solder pads, the solder pads being electrically connected the mounting section;
at least one adhesive layer being disposed on the binding region of the inserting section; and
at least one conduction skirting board being correspondingly fixed to the inserting section, each of the at least one conduction skirting board having a rigid substrate and a plurality of conductive pads, each of the conductive pads having an outer contacting part and an adapting part; the
outer contacting part being located on an outer surface of the rigid substrate, the adapting part passing through the outer surface and an inner surface of the rigid substrate, and connecting the outer contacting part;
wherein a part of the conductive pads correspondingly electrically connects the solder pads, and a part of the rigid substrate is fixedly connected to the binding region of the inserting section by the adhesive layer.