US Patent No. 10,433,426

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME


Patent No. 10,433,426
Issue Date October 01, 2019
Title Circuit Board And Method For Manufacturing The Same
Inventorship Po-Hsuan Liao, Taoyuan (TW)
Assignee UNIMICRON TECHNOLOGY CORP., Taoyuan (TW)

Claim of US Patent No. 10,433,426

1. A circuit board, comprising:a substrate;
a first dielectric layer disposed on the substrate;
an adhesive layer bonded to the first dielectric layer and having a top surface opposite to the substrate;
a second dielectric layer disposed on the adhesive layer and having at least one first through hole;
a first conductive line located in the first through hole of the second dielectric layer, wherein a lowermost surface of the first conductive line is in contact with the top surface of the adhesive layer and the first conductive line is above an entirety of the adhesive layer; and
a plurality of second conductive lines penetrating through the adhesive layer and the second dielectric layer and being in contact with the first dielectric layer, wherein the first conductive line is located between adjacent two of the second conductive lines.