US Patent No. 10,433,425

THREE-DIMENSIONAL HIGH QUALITY PASSIVE STRUCTURE WITH CONDUCTIVE PILLAR TECHNOLOGY


Patent No. 10,433,425
Issue Date October 01, 2019
Title Three-dimensional High Quality Passive Structure With Conductive Pillar Technology
Inventorship Kai Liu, San Diego, CA (US)
Changhan Hobie Yun, San Diego, CA (US)
Jonghae Kim, San Diego, CA (US)
Mario Francisco Velez, San Diego, CA (US)
Assignee QUALCOMM Incorporated, San Diego, CA (US)

Claim of US Patent No. 10,433,425

1. A device, comprising:a substrate including a first RDL (first redistribution layer);
a 3D integrated passive device (three-dimensional integrated passive device) on the substrate;
a plurality of pillars on the substrate, each of the plurality of pillars taller than the 3D integrated passive device;
a molding compound on the substrate and surrounding the 3D integrated passive device and the plurality of pillars; and
a plurality of external interconnects coupled to the first RDL through the plurality of pillars, the 3D integrated passive device coupled to the plurality of external interconnects via the first RDL and the plurality of pillars.