US Patent No. 10,433,424

ELECTRONIC MODULE AND THE FABRICATION METHOD THEREOF


Patent No. 10,433,424
Issue Date October 01, 2019
Title Electronic Module And The Fabrication Method Thereof
Inventorship Chun-Tiao Liu, Hsinchu (TW)
Bau-Ru Lu, Hsinchu (TW)
Assignee CYNTEC CO., LTD, Hsinchu (TW)

Claim of US Patent No. 10,433,424

1. An electronic module, comprising:a unitary substrate, having a top surface and a bottom surface, wherein the unitary substrate is made of a single insulating layer extending from the top surface to the bottom surface of the unitary substrate, wherein there is no horizontally-placed conductive layer that is disposed between said top surface and said bottom surface of the unitary substrate, wherein a conductive layer is disposed on the top surface of the unitary substrate;
a plurality of first discrete electronic components, embedded inside the unitary substrate and electrically connected to the conductive layer, wherein a top surface of each of the plurality of first discrete electronic components is respectively located lower than the top surface of the unitary substrate, and a bottom surface of each of the plurality of first discrete electronic components is respectively located higher than the bottom surface of the unitary substrate;
a second discrete inductor, comprising a magnetic body and a coil encapsulated in the magnetic body, wherein the magnetic body is disposed over the top surface of the unitary substrate; and
a molding body, disposed over the top surface of the unitary substrate and the plurality of first discrete electronic components to encapsulate the magnetic body of the second discrete inductor, wherein the second discrete inductor embedded in the molding body is electrically connected to a discrete electronic component of the plurality of first discrete electronic components via the conductive layer disposed on the top surface of the unitary substrate and a conductive via that is entirely disposed inside the unitary substrate.