US Patent No. 10,433,423

METHOD FOR MANUFACTURING CIRCUIT BOARD, AND CIRCUIT BOARD


Patent No. 10,433,423
Issue Date October 01, 2019
Title Method For Manufacturing Circuit Board, And Circuit Board
Inventorship Tsuyoshi Sakita, Yokkaichi (JP)
Assignee SUMITOMO WIRING SYSTEMS, LTD., Mie (JP)

Claim of US Patent No. 10,433,423

1. A circuit board in which a main substrate has a first surface and a second surface, a terminal fitting and an electronic component are soldered to the first surface, a sub substrate has a first surface and a second surface and is arranged on a second surface side of the main substrate with a predetermined gap therebetween, two ends of a relay terminal are respectively soldered to and span between the first surface of the sub substrate and the second surface of the main substrate, and a separated surface is formed at a predetermined side edge of the main substrate and a predetermined side edge of the sub substrate, wherein the separated surface is a surface formed by disconnecting the main substrate and the sub substrate from a state of being physically connected in the same plane.