1. A structure, comprising:a substrate having one or more dielectric layers including a conductive trace and a ground plane; and
a plurality of land pads on the surface of the substrate, the land pads each comprising:
a conductive portion electrically coupled with the conductive trace by one or more vias, the conductive portion having a contact area and a thickness, the contact area for making electrical contact to an individual land grid array (LGA) contact, wherein the contact area is parallel to the ground plane; and
one or more non-conductive voids in the contact area and extending through the thickness of the conductive portion, wherein the conductive portion is continuous around the one or more non-conductive voids.