US Patent No. 10,427,985

ENGINEERED MICRO-VOIDS FOR TOUGHENING CERAMIC COMPOSITES


Patent No. 10,427,985
Issue Date October 01, 2019
Title Engineered Micro-voids For Toughening Ceramic Composites
Inventorship Daniel H. Hecht, Fort Worth, TX (US)
Antonio P. De La Garza, III, Hudson Oaks, TX (US)
Assignee Lockheed Martin Corporation, Menlo Park, CA (US)

Claim of US Patent No. 10,427,985

1. A ceramic composite material comprising:a ceramic compound;
a plurality of shaping particles dispersed in the ceramic compound; and
a plurality of a first type of void spaces dispersed in the ceramic compound;
wherein:
the plurality of shaping particles are contained within the plurality of the first type of void spaces;
the shaping particles comprise nanostructures have a length to diameter ratio of less than or equal to 10 to 1 and a length of less than or equal to 500 nanometers; and
each of the plurality of the first type of void spaces is a closed cell.