US Patent No. 10,412,841


Patent No. 10,412,841
Issue Date September 10, 2019
Title Flexible Printed Circuit Board And Method For Manufacturing The Same
Inventorship Tzu-Chien Yeh, New Taipei (TW)
Assignee Avary Holding (Shenzhen) CO., Limited., Shenzhen (CN) HongQiSheng Precisio...

Claim of US Patent No. 10,412,841

1. A method for making a flexible printed circuit board comprising:providing an insulating laminate comprising a base layer, the base layer having two opposite surfaces, a releasing films formed on each surface of the base layer;
defining at least one first through hole in the insulating laminate, each first through hole passing through the base layer and the two releasing films;
forming a conductive paste block in each first through hole, each conductive paste block comprises a first end portion and a second end portion opposite to the first end portion, at least the first end portion protruding from the base layer;
removing the releasing films;
forming a first conductive wiring layer, an insulating layer, and a second conductive wiring layer on each surface of the base layer and in that order, the first end portion of each conductive paste block exposed from the first conductive wiring layer;
defining at least one second through hole in the insulating layer, the second through hole coaxially aligned with each conductive paste block, the second through hole positioned near the first end portion extending to the first end portion and forming a recess in the first end portion; and
forming a conductive via in each second through hole and the correspond recess.