1. A method for manufacturing an electronic component, the method comprising:inserting a plurality of multilayer chips into a plurality of cavities formed in a pallet, respectively, the plurality of multilayer chips each including a laminated body having a plurality of ceramic layers and a plurality of internal electrode layers;
aligning the plurality of multilayer chips by moving each of the plurality of multilayer chips to one of inner wall surfaces that form the cavities;
providing a liquid repellent film that repels a conductive ink on an upper surface of the pallet;
applying the conductive ink to ends of the plurality of aligned multilayer chips, and the liquid repellent film on the upper surface of the pallet; and
drying the applied conductive ink to form external electrodes on the plurality of multilayer chips
wherein in the applying step, the conductive ink which adheres to the upper surface of the pallet in the application is guided into the cavities or a region of the upper surface of the pallet, the region being a region without the liquid repellent film provided.