US Patent No. 10,398,063

SYSTEM AND METHOD FOR FLUID COOLING OF ELECTRONIC DEVICES INSTALLED IN AN ENCLOSURE


Patent No. 10,398,063
Issue Date August 27, 2019
Title System And Method For Fluid Cooling Of Electronic Devices Installed In An Enclosure
Inventorship David Lane Smith, Montgomery, TX (US)

Claim of US Patent No. 10,398,063

1. A system for facilitating transfer of thermal energy from a volume of a containment vessel, said system comprising:said containment vessel enclosing said volume;
a primary dielectric thermally conductive fluid at least partially filling said volume of said containment vessel;
at least one heat-generating electronic device immersed in the primary dielectric thermally conductive fluid disposed within said volume of said containment vessel;
at least one solid or sealed hollow structure disposed in said volume of said containment vessel for a volumetric displacement of said primary dielectric thermally conductive fluid disposed within said containment vessel, said at least one solid or sealed hollow structure adjacent to one of more of said at least one heat-generating electronic device, said at least one solid or sealed hollow structure is arranged to form at least one channel for directing a flow of a portion of said primary dielectric thermally conductive fluid upwards and towards at least one side of said at least one solid or sealed hollow structure,
wherein said at least one channel of said at least one solid or sealed hollow structure comprises:
at least one first feature comprising at least one surface, said at least one surface of said at least one first feature configured to direct an upward flow of said portion of said primary dielectric thermally conductive fluid; and
at least one second feature configured to receive said upward flow of said portion of said primary dielectric thermally conductive fluid from said at least one first feature and to direct a flow of said portion of said primary dielectric thermally conductive fluid to exit said at least one second feature at said at least one side of said at least one solid or sealed hollow structure, thereby preventing said portion of said primary dielectric thermally conductive fluid from rising directly above said at least one heat-generating electronic device, said at least one second feature comprising:
at least one first end in fluid communication with said at least one first feature;
an opposing at least one second end at said at least one side of said at least one solid or sealed hollow structure; and
an upper surface preventing said portion of primary dielectric thermally conductive fluid from said rising directly above said at least one heat-generating electronic device.