US Patent No. 10,398,060

DISCRETE COOLING MODULE


Patent No. 10,398,060
Issue Date August 27, 2019
Title Discrete Cooling Module
Inventorship Christopher Strickland Beall, Woodinville, WA (US)
David Edward Bryan, Seattle, WA (US)
Darin Lee Frink, Seattle, WA (US)
Jason Alexander Harland, Seattle, WA (US)
Assignee Amazon technologies, Inc., Reno, NV (US)

Claim of US Patent No. 10,398,060

1. A system for storing data, comprising:a rack;
one or more data storage modules coupled to the rack, a data storage module of the one or more data storage modules comprising:
a chassis that partially bounds a chassis interior such that the chassis encompasses a front end, opposing side ends, and a bottom end of the chassis interior;
two or more backplanes coupled to the chassis; and
one or more mass storage devices coupled to at least one of the backplanes within the chassis interior; and
a discrete cooling module configured to, when coupled to the chassis, enable discrete cooling of the one or more mass storage devices in the chassis of the data storage module, the discrete cooling module comprising:
at least one air moving device coupled to an air cover, wherein when the discrete cooling module is coupled to the chassis, configuration of the air cover determines a position of the at least one air moving device relative to the chassis;
the at least one air moving device configured to induce an airflow through the chassis interior of the data storage module, such that the airflow removes heat from at least one heat producing component of each of the one or more mass storage devices in the chassis interior; and
the air cover configured to:
bound at least a portion of a top end of the chassis interior that is unbounded by the chassis and direct the airflow through the chassis interior to enable the discrete cooling, and extend above the one or more mass storage devices, between a first vertically-oriented plane defined by an inlet end of the chassis and a second vertically-oriented plane defined by an exhaust end of the chassis when coupled with the chassis.