US Patent No. 10,398,038

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD


Patent No. 10,398,038
Issue Date August 27, 2019
Title Printed Wiring Board And Method For Manufacturing Printed Wiring Board
Inventorship Kazuki Kajihara, Ogaki (JP)
Naoki Kurahashi, Ogaki (JP)
Assignee IBIDEN CO., LTD., Ogaki (JP)

Claim of US Patent No. 10,398,038

1. A printed wiring board, comprising:a laminate having a first surface and a second surface;
a plurality of conductor posts formed on the second surface of the laminate on an opposite side with respect to the first surface of the laminate; and
a mold resin layer formed on the second surface of the laminate such that the conductor posts is formed in the mold resin layer covering side surfaces of the conductor posts,
wherein the laminate comprises a plurality of conductor layers and at least one resin insulating layer, the plurality of conductor layers includes a first conductor layer formed such that the first conductor layer is embedded in one of the at least one resin insulating layer forming the second surface of the laminate and has one surface being substantially flush with the second surface of the laminate and exposed on a second surface side of the laminate, the first conductor layer includes a plurality of first conductor pads and a plurality of second conductor pads formed such that the plurality of second conductor pads is formed on an outer peripheral side of the plurality of first conductor pads, the mold resin layer has a cavity exposing the first conductor pads, the plurality of conductor posts is formed on the plurality of second conductor pads respectively on the second surface side of the laminate, the first conductor layer includes a plurality of fan-out wirings extending from inside the cavity to outside the cavity, and the laminate comprises a plurality of via conductors formed in the resin insulating layer such that each of the via conductors is tapering from the first surface toward the second surface of the laminate.