US Patent No. 10,398,037


Patent No. 10,398,037
Issue Date August 27, 2019
Title Printed Circuit Board And Electronic Device
Inventorship Kunihiko Minegishi, Yokohama (JP)
Mitsutoshi Hasegawa, Yokohama (JP)
Takashi Sakaki, Inagi (JP)

Claim of US Patent No. 10,398,037

1. A printed circuit board comprising:an electronic component provided with a plurality of first lands on a bottom surface thereof; and
a printed wiring board having a primary surface facing the bottom surface of the electronic component,
wherein the printed wiring board includes:
a solder resist arranged on the primary surface, the solder resist having a plurality of first apertures and at least one second aperture around at least one of the first apertures; and
a plurality of second lands arranged in the plurality of first apertures on the primary surface so as to face the plurality of first lands respectively,
wherein the plurality of first lands and the plurality of second lands are respectively bonded to each other by means of a solder,
wherein at least one metal member is provided in the at least one second aperture,
wherein a cured thermosetting resin surrounds the solder such that the resin is held in contact with the at least one metal member and bonds the bottom surface of the electronic component to the solder resist on the primary surface, and
wherein, in a plan view of the printed circuit board as seen from a side of the electronic component, a total area of the at least one metal member is not greater than a total area of the solder resist in a region of the primary surface corresponding to a projection area of the electronic component.