US Patent No. 10,398,034

METHODS OF ETCHING CONDUCTIVE FEATURES, AND RELATED DEVICES AND SYSTEMS


Patent No. 10,398,034
Issue Date August 27, 2019
Title Methods Of Etching Conductive Features, And Related Devices And Systems
Inventorship Nava Shpaisman, Kedumim (IL)
Moshe Frenkel, Jerusalem (IL)
Assignee Kateeva, Inc., Newark, CA (US)

Claim of US Patent No. 10,398,034

1. A method of making a device patterned with one or more electrically conductive features, the method comprising:depositing a conductive material layer over an electrically insulating surface of a substrate;
depositing an anti-corrosive material layer over the conductive material layer;
depositing an etch-resist material layer over the anti-corrosive material layer, the etch-resist material layer and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device;
performing a wet-etch process to remove the exposed portions of the conductive material layer from the electrically insulating substrate; and
removing the bi-component etch mask to expose the remaining conductive material of the covered portions of the conductive material layer, thereby forming the one or more electrically conductive features of the device.