US Patent No. 10,398,030

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME


Patent No. 10,398,030
Issue Date August 27, 2019
Title Multilayer Electronic Component And Board Having The Same
Inventorship Heung Kil Park, Suwon-Si (KR)
Gu Won Ji, Suwon-Si (KR)
Se Hun Park, Suwon-Si (KR)
Assignee SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do (KR)

Claim of US Patent No. 10,398,030

1. A multilayer electronic component comprising:a multilayer capacitor including:
a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface, and
first and second external electrodes including first and second body portions disposed on third and fourth surfaces of the capacitor body and connected to the internal electrodes, first and second band portions respectively extending from the first and second body portions to portions of a second surface of the capacitor body, and third and fourth band portions respectively extending from the first and second body portions to portions of a first surface of the capacitor body, the first and second surfaces opposing each other and connected to each other by the third and fourth surfaces; and
first and second metal frames having first and second solder pockets and including first and second vertical portions, first and second upper horizontal portions extending from upper ends of the vertical portions and covering the first and second band portions, respectively, and first and second lower horizontal portions extending from lower ends of the vertical portions, respectively, the upper horizontal portions connected to the first and second band portions of the first and second external electrodes, respectively,
wherein 0.1?G/CT?0.7 is satisfied, in which CT is a height of the first vertical portion or a height of the second vertical portion, and G is a distance, in a direction along which the internal electrodes are stacked, between the first band portion and the lower end of the first vertical portion or between the second band portion and the second end of the second vertical portion,
the first and second solder pockets include first and second cutout portions formed in the first and second metal frames, respectively,
the first cutout portion includes a first stress suppressing portion, having a curved shape, formed at the lower end of the first vertical portion and a first solder receiving portion, having a curved shape, formed at one end of the first lower horizontal portion and communicating with the first stress suppressing portion, and
the second cutout portion includes a second stress suppressing portion, having a curved shape, formed at the lower end of the second vertical portion and a second solder receiving portion, having a curved shape, formed at one end of the second lower horizontal portion and communicating with the second stress suppressing portion.