US Patent No. 10,398,027

WIRING BOARD


Patent No. 10,398,027
Issue Date August 27, 2019
Title Wiring Board
Inventorship Kazuhiro Oshima, Nagano (JP)
Junji Sato, Nagano (JP)
Hitoshi Kondo, Nagano (JP)
Katsuya Fukase, Nagano (JP)
Assignee SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi (JP)

Claim of US Patent No. 10,398,027

1. A wiring board comprising:a wiring structure comprising:
a first insulating layer;
a first wiring layer formed on a bottom surface of the first insulating layer; and
a protective insulating layer which covers the bottom surface of the first insulating layer and has a first opening that exposes a portion of the bottom surface of the first wiring layer, wherein the portion of the bottom surface of the first wiring layer, which is exposed through the first opening, serves as a first pad; and
a support base member which is bonded to the protective insulating layer with an adhesive layer and has a second opening that exposes the first pad,
wherein:
the support base member comprises a top surface on which the adhesive layer is formed and a bottom surface opposite to the top surface; and
a diameter of the second opening at a position between the top surface and the bottom surface of the support base member in a thickness direction of the support base member is smaller than a diameter of the second opening at the top surface of the support base member and a diameter of the second opening at the bottom surface of the support base member, and smaller than a diameter of the first opening.