US Patent No. 10,398,026

LAMINATED SUBSTRATE AND METHOD OF MANUFACTURING LAMINATED SUBSTRATE


Patent No. 10,398,026
Issue Date August 27, 2019
Title Laminated Substrate And Method Of Manufacturing Laminated Substrate
Inventorship Akihito Goto, Nagoya (JP)
Masahiro Sakata, Nisshin (JP)
Masaki Yamaguchi, Tsukuba (JP)
Assignee TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, Aichi-ken (JP) Hitachi Chemic...

Claim of US Patent No. 10,398,026

1. A method of manufacturing a laminated substrate, the method comprising:preparing a first adhesive sheet having a first through-hole;
preparing a second adhesive sheet having a second through-hole and a third through-hole;
preparing a second substrate having a fourth through-hole;
forming a first post by applying a conductive paste, in which a high melting point metal and a low melting point metal are mixed, to a rear surface of a first substrate or a front surface of the second substrate and heating the applied conductive paste to enter a semi-sintered state;
forming a second post by applying the conductive paste, in which the high melting point metal and the low melting point metal are mixed, to a rear surface of the second substrate or a front surface of a third substrate and heating the applied conductive paste to enter a semi-sintered state;
fixing an electronic component to the front surface of the third substrate; and
after the forming of the first post, the forming of the second post, and the fixing of the electronic component to the front surface of the third substrate, bonding the first substrate, the second substrate, and the third substrate by laminating the first substrate, the second substrate, and the third substrate in a state in which the first adhesive sheet is disposed between the rear surface of the first substrate and the front surface of the second substrate and the second adhesive sheet is disposed between the rear surface of the second substrate and the front surface of the third substrate, and pressing and heating the first substrate, the second substrate, and the third substrate in a lamination direction,
wherein during the bonding, the first post is disposed in the first through-hole to electrically connect the first substrate to the second substrate by the first post, the second post is disposed in the second through-hole to electrically connect the second substrate to the third substrate by the second post, and the electronic component is disposed in the third through-hole and the fourth through-hole.