US Patent No. 10,398,025

PERIPHERAL END FACE ATTACHMENT OF EXPOSED COPPER LAYERS OF A FIRST PRINTED CIRCUIT BOARD TO THE SURFACE OF A SECOND PRINTED CIRCUIT BOARD BY SURFACE MOUNT ASSEMBLY


Patent No. 10,398,025
Issue Date August 27, 2019
Title Peripheral End Face Attachment Of Exposed Copper Layers Of A First Printed Circuit Board To The Surface Of A Second Printed Circuit Board By Surface Mount Assembly
Inventorship Todd E. Takken, Brewster, NY (US)
Xin Zhang, Yorktown Heights, NY (US)
Yuan Yao, Tarrytown, NY (US)
Andrew Ferencz, Southborough, MA (US)
Assignee International Business Machines Corporation, Armonk, NY (US)

Claim of US Patent No. 10,398,025

1. A printed circuit board (PCB) comprising:a laminate substrate having a top and a bottom areal main face (AMF), the laminate substrate having multiple layers of a non-conductive substrate material, the layers forming at least one peripheral end face (PEF) surface separating the top and bottom AMF;
conductive wiring at one or more of the multiple layers embedded within the substrate, the conductive wiring adapted for carrying signals to first PCB surface mounted devices;
the PEF surface including one or more recessed sections, wherein at each recessed section, the embedded conductive wiring at the multiple layers includes one or more conductive wire ends exposed at and coplanar with the PEF surface, the exposed conductive wire ends forming one or more separate electrical contacts across the thickness of the PEF and forming one or more continuous or multiple separate electrical contacts along a length of each conducting layer that is exposed at the PEF surface at the recessed section, the PCB adapted to be directly mounted along its PEF surface at the recessed section to an AMF surface of a second printed circuit board (second PCB) using a surface mount solder material, the one or more continuous or multiple separate electrical contacts making direct electrical and/or thermal contact to corresponding mating conducting areas on the AMF of the second PCB via the surface mount solder material.