US Patent No. 10,398,023

SEMICONDUCTOR DEVICE


Patent No. 10,398,023
Issue Date August 27, 2019
Title Semiconductor Device
Inventorship Hideyo Nakamura, Kawasaki (JP)
Masafumi Horio, Kawasaki (JP)
Assignee FUJI ELECTRIC CO., LTD., Kawasaki-sShi, Kanagawa (JP)

Claim of US Patent No. 10,398,023

1. A semiconductor device comprising:a first insulating substrate having a first circuit board on an upper surface thereof and having a first metal board on an under surface thereof, the first circuit board having a first switching element and a first diode mounted thereon;
a second insulating substrate having a second circuit board on an upper surface thereof and having a second metal board on an under surface thereof, the second circuit board having a second switching element and a second diode mounted thereon;
a printed circuit board including a metal layer and being disposed opposite to the first insulating substrate and the second insulating substrate;
at least one first conductive post connecting the metal layer of the printed circuit board with the first circuit board; and
at least one second conductive post connecting the metal layer of the printed circuit board with the second circuit board,
wherein the first insulating substrate and the second insulating substrate are disposed side by side in a horizontal direction,
the at least one first conductive post is connected to the first circuit board at a location spaced apart from the first switching element and the first diode,
the first switching element and the second switching element are configured to form a bidirectional switch,
the first switching element is connected to the first diode in inverse parallel,
the second switching element is connected to the second diode in inverse parallel, and
the first switching element is connected to the second switching element in anti-series via the first circuit board, the at least one first conductive post, the metal layer, the at least one second conductive post and the second circuit board.