US Patent No. 10,398,020

CIRCUIT ASSEMBLY AND MANUFACTURING METHOD OF CIRCUIT ASSEMBLY


Patent No. 10,398,020
Issue Date August 27, 2019
Title Circuit Assembly And Manufacturing Method Of Circuit Assembly
Inventorship Koki Uchida, Yokkaichi (JP)
Yukinori Kita, Yokkaichi (JP)
Assignee AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP) SUMITOMO WIRING SYSTEMS, LTD., ...

Claim of US Patent No. 10,398,020

1. A circuit assembly comprising:a heat generator;
a circuit board, which has a conduction path, and to which the heat generator is mounted;
a heat dissipating member arranged facing the circuit board;
an insulating film arranged in a region that is overlapped by the heat generator between the circuit board and the heat dissipating member;
an adhesive or sticky first heat conductor that is arranged between the circuit board and the insulating film and is in contact with the circuit board and the insulating film; and
an adhesive or sticky second heat conductor that is arranged between the insulating film and the heat dissipating member and is in contact with the insulating film and the heat dissipating member, wherein:
the circuit board and the heat dissipating member are fixed together, and
an air layer is formed between the circuit board and the heat dissipating member in a region in which the insulating film is not arranged.