US Patent No. 10,368,464

THERMAL SOLUTION FOR TRANSCEIVER MODULE


Patent No. 10,368,464
Issue Date July 30, 2019
Title Thermal Solution For Transceiver Module
Inventorship Chao-Jung Chen, Taoyuan (TW)
Yu-Nien Huang, Taoyuan (TW)
Kuen-Hsien Wu, Taoyuan (TW)
Kuo-Wei Lee, Taoyuan (TW)
Assignee QUANTA COMPUTER INC., Taoyuan (TW)

Claim of US Patent No. 10,368,464

1. An apparatus for cooling a transceiver, the apparatus comprising:a cooling jacket configured to receive the transceiver, wherein the transceiver is secured within the cooling jacket via a connecting structure;
a plurality of cooling devices secured to an exterior surface of a housing, wherein the plurality of cooling devices comprises a highly thermal conductivity material, the plurality of cooling devices including a heat pipe running along the topside of the transceiver; and
a heat dissipation device connected to a distal end of each of the plurality of cooling devices,
wherein the heat dissipation device comprises a radiator connected to a pipe comprising cool water from a reservoir.