US Patent No. 10,368,454

SHOCK ABSORBING STRUCTURE ADAPTED FOR A CIRCUIT BOARD OF AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE THEREWITH


Patent No. 10,368,454
Issue Date July 30, 2019
Title Shock Absorbing Structure Adapted For A Circuit Board Of An Electronic Device And Electronic Device Therewith
Inventorship Heng-Min Liu, New Taipei (TW)
Chun-Wang Lin, New Taipei (TW)
Chin-Chung Hung, New Taipei (TW)
Tsung-Hsien Chen, New Taipei (TW)
Shih-Wei Tung, New Taipei (TW)
Assignee Wistron Corporation, New Taipei (TW)

Claim of US Patent No. 10,368,454

7. An electronic device comprising:a first electronic module comprising a first circuit board and a first electrical connector;
a second electronic module comprising a second circuit board and a second electrical connector; and
a shock absorbing structure for reducing a stress between the first electrical connector and the second electrical connector when the first electrical connector is connected with the second electrical connector, the shock absorbing structure comprising:
at least one protruding column fixed on the second electronic module and passing through the second circuit board, the at least one protruding column comprising a fixing portion and a protruding portion connected to the fixing portion, the fixing portion being fixed onto the second electronic module, and the protruding portion passing through the second circuit board; and
at least one resilient module disposed between the at least one protruding column and the second circuit board, the at least one resilient module comprising a first resilient component and a second resilient component, the first resilient component being sleeved on the protruding portion and passing through the second circuit board, a side of the first resilient component abutting against the fixing portion, and the second resilient component being sleeved on the first resilient component and abutting between the fixing portion and the second circuit board;
wherein when the electronic device is forced to vibrate by an external impact, the second circuit board presses the at least one resilient module, so that the at least resilient module is deformed to generate a resilient force, the resilient force drives the second circuit board to recover when the second circuit board does not press the at least one resilient module, the second resilient component is pressed to be deformed by the second circuit board when the second circuit board moves along a first direction, and the first resilient component is pressed to be deformed by the second circuit board when the second circuit board moves along a second direction perpendicular to the first direction.