US Patent No. 10,368,445

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME


Patent No. 10,368,445
Issue Date July 30, 2019
Title Multilayer Rigid Flexible Printed Circuit Board And Method For Manufacturing The Same
Inventorship Yang Je Lee, Suwon-si (KR)
Dek Gin Yang, Suwon-si (KR)
Dong Gi An, Suwon-si (KR)
Jae Ho Shin, Suwon-si (KR)
Assignee Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)

Claim of US Patent No. 10,368,445

1. A multilayer rigid flexible printed circuit board comprising:a flexible film comprising a first circuit pattern on one or both surfaces, and having an area corresponding to a rigid region and a flexible region of the multilayer rigid flexible printed circuit board, the first circuit pattern comprising a first portion in the flexible region and a second portion in the rigid region;
a first insulating layer disposed on the flexible film in the flexible region to cover the first portion of the first circuit pattern and having an extension portion extending into the flexible film in the rigid region;
a copper pattern positioned at the rigid region of the flexible film and disposed on the extension portion of the first insulating layer; and
a second insulating layer disposed on and in contact with the flexible film in the rigid region, covering the copper pattern, and comprising a second circuit pattern,
wherein the copper pattern is physically isolated from the first circuit pattern and the second circuit pattern.