US Patent No. 10,368,444

FINGERPRINT MODULE, METHOD FOR MANUFACTURING THE FINGERPRINT MODULE, AND MOBILE TERMINAL


Patent No. 10,368,444
Issue Date July 30, 2019
Title Fingerprint Module, Method For Manufacturing The Fingerprint Module, And Mobile Terminal
Inventorship Wenzhen Zhang, Dongguan (CN)
Assignee Guangdong Oppo Mobile Telecommunications Corp., Ltd., Dongguan (CN)

Claim of US Patent No. 10,368,444

1. A fingerprint module, comprising:a cover plate defining an assembling region;
a fingerprint chip fixed in the assembling region;
an intermediate board bonded to a surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip; and
a circuit board electrically connected to the fingerprint chip via the intermediate board;
wherein the intermediate board is a printed circuit board, the intermediate board comprises a first contact surface bonded to the fingerprint chip and a second contact surface opposite to the first contact surface, a plurality of first pins is electrically connected to the fingerprint chip and disposed on the first contact surface, a plurality of second pins is electrically connected to the first pins and disposed on the second contact surface, and the circuit board is bonded to the second contact surface and electrically connected to the second pins;
wherein the circuit board comprises a first terminal and a second terminal, the first terminal is soldered to the second pins of the intermediate board, a connector is disposed at the second terminal, and the connector is pluggable into a main board of a mobile terminal.