US Patent No. 10,368,443


Patent No. 10,368,443
Issue Date July 30, 2019
Title Connection Body, Method For Manufacturing Connection Body, And Method For Inspecting Same
Inventorship Reiji Tsukao, Tochigi (JP)

Claim of US Patent No. 10,368,443

1. A connection body comprising:a transparent board including a plurality of terminals arranged on a surface of the transparent board; and
an electronic component including a plurality of bumps arranged on a surface of the electronic component, the electronic component facing the transparent board in a first direction and being connected to the transparent board via an anisotropic electrically conductive adhesive including electrically conductive particles dispersed in a binder resin, the electrically conductive particles having a particle size, the plurality of bumps being electrically connected to the plurality of terminals via the electrically conductive particles with the electronically conductive particles trapped between the plurality of bumps and the plurality of terminals,
wherein the electrically conductive particles are independent of and out of contact with one another, and
plural bumps of the plurality of bumps each have an uneven surface facing the transparent board and with a surface area, the surface having a recess and a projection having a height difference in the first direction of greater than or equal to 10 percent of the particle size, the surface being a surface where the electrically conductive particles are trapped, the projection being located at a portion of the surface that is closer to the transparent board than a portion of the surface where the recess is located, the recess and projection including a projection portion defining a maximum projection, and at least one region of the surface having a height difference, measured from the projection portion, of greater than or equal to 20 percent of the particle size occupies less than or equal to 70 percent of the surface area.