US Patent No. 10,368,442

INTEGRATED CIRCUIT STRUCTURE AND METHOD OF FORMING


Patent No. 10,368,442
Issue Date July 30, 2019
Title Integrated Circuit Structure And Method Of Forming
Inventorship Chen-Hua Yu, Hsin-Chu (TW)
Jui-Pin Hung, Hsin-Chu (TW)
Kuo-Chung Yee, Taoyuan (TW)
Assignee Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)

Claim of US Patent No. 10,368,442

1. A method of making a semiconductor device, comprising:placing a die over a carrier substrate;
forming a molding compound adjacent to the die;
forming one or more redistribution layers electrically coupled to the die and overlying the molding compound;
removing the carrier substrate;
connecting a first substrate to the one or more redistribution layers on an opposite side of the one or more redistribution layers from the die; and
connecting the one or more redistribution layers to a printed circuit board, wherein after the one or more redistribution layers are connected to the printed circuit board the one or more redistribution layers only partially overlap the printed circuit board, a first sidewall of the printed circuit board overlies the one or more redistribution layers, and the printed circuit board extends laterally beyond the one or more redistribution layers.