US Patent No. 10,368,441

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CONNECTORS


Patent No. 10,368,441
Issue Date July 30, 2019
Title Method And Apparatus For Strain Relieving Surface Mount Attached Connectors
Inventorship Michael A. Gaynes, Vestal, NY (US)
Jeffrey D. Gelorme, Burlington, CT (US)
Robert P. Kuder, II, Hopewell Junction, NY (US)
Daniel J. Littrell, Carmel, NY (US)
Thomas E. Lombardi, Poughkeepsie, NY (US)
Marie-Claude Paquet, Quebec (CA)
Frank L. Pompeo, Redding, CT (US)
David L. Questad, Hopewell Junction, NY (US)
James Speidell, Poughhquag, NY (US)
Sri M. Sri-Jayantha, Ossining, NY (US)
Son K. Tran, Endicott, NY (US)
Assignee INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)

Claim of US Patent No. 10,368,441

1. An interconnect structure for a circuit board comprising:a component circuit board containing a plurality of electrical components;
a wafer connector assembly including a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact and a backside end opposite the connection end; and
an adhesive adhering to and structurally reinforcing at least a first row of solder joints from said plurality of rows of solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer connector assembly, wherein at least a middle row of solder joints from said plurality of rows of solder joints that is between the connection end and the backside end of the interconnect circuit boards is free of adhesive and wherein the adhesive structurally reinforcing the solder joints relieves strain induced on said solder joints when engaging the wafer connector assembly to the header site of a mid plane board of a computing system chassis.