US Patent No. 10,368,439

ASSEMBLY ARCHITECTURE EMPLOYING ORGANIC SUPPORT FOR COMPACT AND IMPROVED ASSEMBLY THROUGHPUT


Patent No. 10,368,439
Issue Date July 30, 2019
Title Assembly Architecture Employing Organic Support For Compact And Improved Assembly Throughput
Inventorship Adel A. Elsherbini, Chandler, AZ (US)
Aleksandar Aleksov, Chandler, AZ (US)
Sasha N. Oster, Chandler, AZ (US)
Shawna M. Liff, Scottsdale, AZ (US)
Assignee Intel Corporation, Santa Clara, CA (US)

Claim of US Patent No. 10,368,439

1. An apparatus comprising:a substrate comprising a first side and an opposite second side;
at least one first circuit device on the first side of the substrate, at least one second circuit device on the second side of the substrate; and
a support on the second side of the substrate, the support comprising a plurality of pillars, each of the pillars having a two-dimensional array of interconnections therethrough, wherein two or more of the pillars have a different shape from one another, and wherein the interconnections are coupled to first contact pads on a first side of the support and second contact pads on an opposite second side of the support and wherein the first contact pads are coupled to substrate contact pads on the second side of the substrate, respective ones of the interconnections are coupled to the at least one first circuit device and the at least one second circuit device, the support having a thickness dimension operable to define a dimension from the substrate greater than a thickness dimension of the at least one second circuit device.