US Patent No. 10,368,435

SYSTEMS AND METHODS FOR BREADBOARD STYLE PRINTED CIRCUIT BOARD


Patent No. 10,368,435
Issue Date July 30, 2019
Title Systems And Methods For Breadboard Style Printed Circuit Board
Inventorship Samuel P. Kho, Mountain View, CA (US)

Claim of US Patent No. 10,368,435

1. A breadboard style printed circuit board (PCB) system, comprising:a printed circuit board having a first copper layer and a second copper layer;
a first plurality of signal tie points forming a plurality of columns and a plurality of rows, the first plurality of signal tie points on the first copper layer, wherein each signal tie point in a left portion of a row is electrically coupled to each signal tie point in the left portion of the row and each signal tie point in the right portion of the row is electrically coupled to each signal tie point in the right portion of the row;
a second plurality of signal tie points forming a plurality of columns and a plurality of rows, the second plurality of signal tie points on the second copper layer, wherein each signal tie point in the second copper layer has a corresponding signal tie point in the first copper layer;
an electrical connection between the first signal tie points in the first copper layer and corresponding second signal tie points in the second copper layer;
a plurality of power rails arranged vertically;
a plurality of embedded wires, formed from a plurality of copper structures, between each of the plurality of columns and the plurality of rows, the plurality of embedded wires capable of connecting any two signal tie points on the first copper layer, wherein the connection is made once the electrical connection is completed; and
a plurality of solder bridges between each of the plurality of columns and the plurality of rows, the plurality of solder bridges capable of receiving solder to complete the electrical connection and form an electrical connection with the embedded wire to form bread board style connections on the PCB.