US Patent No. 10,368,432

CIRCUIT ASSEMBLIES AND RELATED METHODS


Patent No. 10,368,432
Issue Date July 30, 2019
Title Circuit Assemblies And Related Methods
Inventorship John Song, Barrington, IL (US)
George William Rhyne, Greensboro, NC (US)
Assignee LAIRD TECHNOLOGIES, INC., Chesterfield, MO (US)

Claim of US Patent No. 10,368,432

1. An assembly suitable for use in an electronic device, the assembly comprising:an electrically conductive structure configured for a first functionality in the electronic device;
an electrically nonconductive material on at least part of the electrically conductive structure; and
one or more first electrical components at least partly on the electrically nonconductive material and configured to define at least a portion of a circuit assembly for electrically connecting with one or more second electrical components of the electronic device;
whereby the electrically conductive structure is configured for a second functionality in addition to the first functionality in the electronic device;
wherein the one or more first electrical components comprise a flexible circuit on a flexible printed circuit board mounted on a upper surface of the electrically conductive structure, and a pattern of electrically conductive material on the electrically nonconductive material defining one or more routing connections extending from the flexible circuit and along at least one sidewall of the electrically conductive structure, for electrically connecting the circuit with the one or more second electrical components of the electronic device.