US Patent No. 10,368,431

COOLING ASSEMBLIES FOR ELECTRONIC DEVICES


Patent No. 10,368,431
Issue Date July 30, 2019
Title Cooling Assemblies For Electronic Devices
Inventorship Yu-wei Chen, Taipei (TW)
Yi-kai Lan, Taipei (TW)
Shih-chien Chou, Taipei (TW)
Assignee Astec International Limited, Kwun Tong, Kowloon (HK)

Claim of US Patent No. 10,368,431

1. A cooling assembly for cooling electronic devices, the cooling assembly comprising:a circuit board having a first surface and a second surface opposite the first surface;
a first set of electronic devices, a second set of electronic devices, and a third set of electronic devices, each set including at least two electronic devices electrically coupled in parallel and disposed on the first surface of the circuit board, at least one of the electronic devices of the third set and at least one of the electronic devices of the second set positioned between the at least two electronic devices of the first set; and
a heat sink disposed on the second surface of the circuit board, the heat sink including a first heat sink portion in thermal contact with the first set of electronic devices, a second heat sink portion in thermal contact with the second set of electronic devices, and a third heat sink portion in thermal contact with the third set of electronic devices, the first, second and third heat sink portions positioned in an interleaved arrangement to overlap one another while remaining electrically isolated from one another.