US Patent No. 10,368,400

METHOD AND PACKAGE FOR PACKAGING A THERMAL CONDUCTIVE STRIP WITH POWER SUPPLY TERMINALS


Patent No. 10,368,400
Issue Date July 30, 2019
Title Method And Package For Packaging A Thermal Conductive Strip With Power Supply Terminals
Inventorship Chen-San Cheng, Changhua County (TW)
Assignee TAIWAN TECH CO., LTD., Changhua County (TW)

Claim of US Patent No. 10,368,400

1. A method for packaging a thermal conductive strip with a power supply terminal, comprising the following steps:preparing a plastic envelope which encapsulates a carbon fiber unit, wherein the plastic envelope includes a plastic connecting end, and the carbon fiber unit includes a carbon fiber connecting end which is encapsulated by the plastic connecting end;
clamping the plastic envelope with a positioning mould to fix one end of the plastic envelope;
clamping a pulling mould on the plastic connecting end while the carbon fiber connecting end is not clamped by the pulling mould;
pulling the pulling mould in a direction away from the positioning mould until a part of the plastic connecting end breaks to form a broken portion, so that the carbon fiber connecting end is exposed out of the plastic envelope, wherein the broken portion covers a part of the carbon fiber connecting end;
sleeving the power supply terminal onto the broken portion and the carbon fiber connecting end, adding pressure to make the power supply terminal have a clamping section for clamping the broken portion, and an electrically conductive section for contacting the carbon fiber connecting end.