US Patent No. 10,367,415

PROCESSOR MODULE WITH INTEGRATED PACKAGED POWER CONVERTER


Patent No. 10,367,415
Issue Date July 30, 2019
Title Processor Module With Integrated Packaged Power Converter
Inventorship Noah Sturcken, New York, NY (US)
Ehsan Kalami, Novi, MI (US)
Joseph Meyer, Plainsboro, NJ (US)
Michael Lekas, New York, NY (US)
Assignee Ferric Inc., New York, NY (US)

Claim of US Patent No. 10,367,415

1. An assembly comprising:a processor module comprising:
a processor package substrate having opposing first and second sides;
a processor chip mounted on the first side of the processor package substrate; and
an array of electrical terminations disposed on the second side of the processor package substrate; and
a power management module disposed on the second side of the processor package substrate, the power management module comprising:
a power management package substrate; and
a power converter chip mounted on the power management package substrate, the power converter chip disposed between the power management package substrate and the first or second side of the processor package substrate,
wherein a height of the power management module is less than or equal to a height of the electrical terminations on the second side of the processor package substrate, the height measured with respect to an axis that is orthogonal to a plane defined by the second side of the processor package substrate.