US Patent No. 10,366,971

PRE-APPLYING SUPPORTING MATERIALS BETWEEN BONDED PACKAGE COMPONENTS


Patent No. 10,366,971
Issue Date July 30, 2019
Title Pre-applying Supporting Materials Between Bonded Package Components
Inventorship Yu-Chen Hsu, Hsin-Chu (TW)
Yu-Feng Chen, Hsin-Chu (TW)
Han-Ping Pu, Taichung (TW)
Meng-Tse Chen, Changzhi Township (TW)
Guan-Yu Chen, Hsin-Chu (TW)
Assignee Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)

Claim of US Patent No. 10,366,971

1. A method comprising:disposing a supporting material onto a surface of a first package component, wherein the first package component comprises a plurality of electrical connectors on the surface, wherein the plurality of electrical connectors is adjacent to peripheral regions of the first package component, and wherein the supporting material is adjacent to a center region of the surface;
after the supporting material is disposed, bonding the first package component to a second package component through the plurality of electrical connectors, wherein the supporting material has a first surface in contact with the first package component, and a second surface in contact with the second package component, and the first surface and the second surface are opposite to each other; and
after the bonding encapsulating the supporting material and the plurality of electrical connectors in an encapsulating material, wherein the supporting material and the encapsulating material are different from each other, the supporting material has a sidewall surface different from the first and second surfaces, the encapsulating material is in contact with at least a portion of the sidewall surface, and a portion of the encapsulating material is between the sidewall surface and one of the plurality of electrical connectors.