US Patent No. 10,365,672

METHOD AND SYSTEM FOR MONITORING TEMPERATURE OF WAFER


Patent No. 10,365,672
Issue Date July 30, 2019
Title Method And System For Monitoring Temperature Of Wafer
Inventorship Shu-Han Chen, Changhua (TW)
Sheng-Hung Lin, Taichung (TW)
Han-Hsuan Hsu, Taichung (TW)
Chien-Fang Lin, Tainan County (TW)
Assignee TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)

Claim of US Patent No. 10,365,672

1. A system, comprising:a cooling device configured to detect a temperature of a wafer and to provide air to the wafer;
a memory configured to store computer program codes; and
a processor configured to execute the computer program codes in the memory to determine whether the temperature of the wafer meets a predetermined requirement;
adjust the temperature of the wafer on condition that the temperature does not meet the predetermined requirement; and
control the cooling device to detect the temperature of the wafer again, in order to verify whether an adjusted temperature of the wafer meet the predetermined requirement,
wherein the cooling device comprises:
a fan filter unit configured to provide the air;
a first thermal detector located at a first side of the fan filter unit, wherein the first thermal detector is configured to detect the temperature of the wafer during a movement of the wafer to the first side of the fan filter unit; and
a second thermal detector located at a second side of the fan filter unit, wherein the second thermal detector is configured to detect the adjusted temperature of the wafer during a movement of the wafer from the first side of the fan filter unit to the second side of the fan filter unit, wherein the second side is opposite to the first side with respect to the fan filter unit.