US Patent No. 10,362,929

IMAGING UNIT, IMAGING MODULE, AND ENDOSCOPE


Patent No. 10,362,929
Issue Date July 30, 2019
Title Imaging Unit, Imaging Module, And Endoscope
Inventorship Hiroyuki Motohara, Hachioji (JP)
Yasuhiro Kusano, Fukushima (JP)
Assignee OLYMPUS CORPORATION, Tokyo (JP)

Claim of US Patent No. 10,362,929

1. An imaging unit comprising:a semiconductor package being a chip size package, the semiconductor package including:
an image sensor, and
a connection electrode formed on a back surface of the semiconductor package;
a circuit board being accommodated in a projection plane in an optical axis direction of the semiconductor package, the circuit board including:
a main body including a connection land formed on a front surface, the connection land being electrically and mechanically connected to the connection electrode via a bump, and
an attachment portion protruding on a back surface of the main body and including cable connection electrodes formed on at least two opposing side surfaces among protruding side surfaces;
a plurality of electronic components mounted on an electronic component mounting area on the back surface of the main body of the circuit board; and
a plurality of cables electrically and mechanically connected to the cable connection electrodes of the attachment portion,
wherein the attachment portion protrudes from the main body such that a center plane of the two side surfaces on which the cable connection electrodes are formed to oppose each other is shifted from a center plane of side surfaces of the semiconductor package which are parallel to the two side surfaces of the attachment portion, and at least one side surface is perpendicular to the back surface of the main body,
the electronic component mounting area is arranged side-by-side with the attachment portion on a same plane as the attachment portion,
each of the two opposing side surfaces of the attachment portion including the cable connection electrode formed thereon includes:
a first step portion on the main body side; and
a second step portion on the proximal end side in the optical axis direction of the image sensor; and
the cable connection electrodes are formed on:
a side surface of the second step portion on the electronic component mounting area side;
a side surface of the second step portion opposing the side surface on the electronic component mounting area side; and
the side surface of the first step portion opposing the side surface on the electronic component mounting area side.