US Patent No. 10,352,551

LED MODULE AND METHOD OF SEALING


Patent No. 10,352,551
Issue Date July 16, 2019
Title Led Module And Method Of Sealing
Inventorship Robert Van Asselt, Eindhoven (NL)
Mark Johannes Antonius Verhoeven, Eindhoven (NL)
Joris Jan Vrehen, Eindhoven (NL)
Gerardus Franciscus Cornelis Maria Lijten, Eindhoven (NL)
Laurens Bax, Eindhoven (NL)
Chris Van Den Eerenbeemd, Eindhoven (NL)
Assignee SIGNIFY HOLDING B.V., Eindhoven (NL)

Claim of US Patent No. 10,352,551

1. An LED module comprising:a printed circuit board having an upper surface, a lower surface, and a side surface; the printed circuit board comprising a first layer; a second layer; and a plurality of LEDs adapted to output light from the upper surface; and
an optically transmissive cover plate positioned to cover at least one of the plurality of LEDs and having at least one protrusion arranged to cover a portion of an interface between the first layer and the second layer at the side surface of the printed circuit board,
wherein the first layer forms the lower surface of the printed circuit board, and comprises a first layer side surface that is at least partially inwardly inclined.