US Patent No. 10,342,159

LIQUID HEAT-DISSIPATING ASSEMBLY


Patent No. 10,342,159
Issue Date July 02, 2019
Title Liquid Heat-dissipating Assembly
Inventorship Cheng-Chien Wan, Tainan (TW)
Cheng-Feng Wan, Tainan (TW)
Hao-Hui Lin, Tainan (TW)
Hsiao-Ching Chen, Tainan (TW)
Wei-Che Hsiao, Tainan (TW)
Tung-Hsin Liu, Tainan (TW)
Assignee Man Zai Industrial Co., Ltd., Tainan (TW)

Claim of US Patent No. 10,342,159

1. A liquid heat-dissipating assembly comprising:a heat-guiding tube assembly comprising
a first tube having at least one first channel defined in the first tube and a first peripheral wall formed around the at least one first channel;
a second tube being adjacent to and spaced from the first tube and having at least one second channel defined in the second tube and a second peripheral wall formed around the at least one second channel; and
a separating segment mounted between the first tube and the second tube and comprising a separating channel and multiple connection walls arranged around the separating channel and connected with the first peripheral wall and the second peripheral wall;
multiple heat-dissipating units connected with the heat-guiding tube assembly, and each heat-dissipating unit comprising
a heat-dissipating body having a passage defined in the heat-dissipating body and having two ends defined respectively as an inlet and an outlet;
a first pipe having two ends respectively connected with the inlet of the passage of the heat-dissipating body and the at least one first channel of the first tube; and
a second pipe having two ends respectively connected with the outlet of the passage of the heat-dissipating body and the at least one second channel of the second tube; and
at least one heat-dissipating tube connected with the at least one second channel of the second tube, wherein the at least one first channel includes multiple first channels; and
a first baffle is formed between each pair of adjacent two of the multiple first channels and has a first spacing channel defined in the first baffle.