US Patent No. 10,342,143

PRODUCTION METHOD FOR PRINTED WIRING BOARD HAVING DIELECTRIC LAYER


Patent No. 10,342,143
Issue Date July 02, 2019
Title Production Method For Printed Wiring Board Having Dielectric Layer
Inventorship Toshiyuki Shimizu, Saitama (JP)
Toshifumi Matsushima, Saitama (JP)
Yoshihiro Yoneda, Saitama (JP)
Assignee

Claim of US Patent No. 10,342,143

1. A laminated member comprising: a resin substrate; and a pair of metal clad laminates,the metal clad laminate comprising: a dielectric layer having a thickness of 30 ?m or less and a strain energy at break of 1.8 MJ or less; a first metal foil arranged on a first surface of the dielectric layer; a second metal foil arranged on a second surface of the dielectric layer; a first carrier arranged on the first metal foil via a releasable layer; and a second carrier arranged on the first metal foil via a releasable layer,
the pair of metal clad laminates being arranged on the resin substrate in such a manner that the first carrier of each metal clad laminate faces each surface of the resin substrate.