US Patent No. 10,342,141

OPTOELECTRONIC SUBASSEMBLY WITH COMPONENTS MOUNTED ON TOP AND BOTTOM OF SUBSTRATE


Patent No. 10,342,141
Issue Date July 02, 2019
Title Optoelectronic Subassembly With Components Mounted On Top And Bottom Of Substrate
Inventorship Maziar Amirkiai, Sunnyvale, CA (US)
Yunpeng Song, Fremont, CA (US)
Peter Henry Mahowald, Sunnyvale, CA (US)
Hongyu Deng, Saratoga, CA (US)
Assignee FINISAR CORPORATION, Sunnyvale, CA (US)

Claim of US Patent No. 10,342,141

1. A method comprising:providing a multilayer substrate with a substrate top and a substrate bottom;
positioning an optoelectronic transducer on the substrate top;
positioning at least one driver on the substrate top;
positioning a controller directly against the substrate bottom;
electrically coupling the controller with the driver with at least one via extending through multiple layers of the multilayer substrate; and
electrically coupling the driver and the optoelectronic transducer with at least one signal line on the substrate top such that the controller sends control signals to the driver and the optoelectronic transducer.