US Patent No. 10,342,140

PRINTED CIRCUIT BOARD TO MOLDED COMPOUND INTERFACE


Patent No. 10,342,140
Issue Date July 02, 2019
Title Printed Circuit Board To Molded Compound Interface
Inventorship Chien-Hua Chen, Corvallis, OR (US)
Gary G. Lutnesky, Corvallis, OR (US)
Michael W. Cumbie, Corvallis, OR (US)
Eric L. Nikkel, Corvallis, OR (US)
Assignee HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US)

Claim of US Patent No. 10,342,140

1. An apparatus comprising:a printed circuit board having a first coefficient of thermal expansion;
a compound molded about the printed circuit board, the compound having a second coefficient of thermal expansion different than the first coefficient of thermal expansion; and
an interface between an edge of the printed circuit board and the compound, the interface having a third coefficient of thermal expansion between the first coefficient of thermal expansion and the second coefficient of thermal expansion.